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SPL701 Heat Resistant PLA Resin For Thermoforming Packaging And 3D Printing

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SPL701 Heat Resistant PLA Resin For Thermoforming Packaging And 3D Printing

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Moisturecontent : <0.3%

Shelflife : 12 months

Elongation at break : 3-10%

Meltingpoint : 150-160°C

Tensile strength : 50-70 MPa

Melting point : 150-160°C

Payment Terms : L/C,T/T

Elongationatbreak : 3-10%

Sample : Available

MOQ : 1 tons

Density : 1.24 g/cm³

Brand Name : JIAOU

Place of Origin : CHINA

Price : To Be Negotiated

Delivery Time : 5-20 Days

Supply Ability : 1000 Tons per Month

Productname : PLA Resin SPL701

Packaging Details : Ton bag

Glass transition temperature : 55-60°C

Glasstransitiontemperature : 55-60°C

Moisture content : <0.3%

Appearance : Opaque Pellets

Tensilestrength : 50-70 MPa

Applications : thermoforming packaging, such as microwave food containers, hot filling containers,

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SPL701 Heat Resistant PLA Resin – Microwave Trays & Hot Fill Containers
Product Description
SPL701 is a medium-high optical purity PLA resin with L-lactide content greater than 98%. This specialized material features a melting point of ≥160°C and is supplied as off-white pellets. It is specifically engineered for producing heat-resistant thermoformed packaging applications including microwaveable trays, hot fill cups, and lids.
Suitable for sheet extrusion, roll forming, fiber production, and 3D printing applications. While offering a lower output rate compared to SPL101, SPL701 provides broader application versatility for demanding thermal environments. Requires drying at 80°C for 4-6 hours before processing.
Product Specifications
SPL701 Heat Resistant PLA Resin For Thermoforming Packaging And 3D Printing

SPL701 Heat Resistant PLA Resin For Thermoforming Packaging And 3D Printing
Packaging Method
SPL701 Heat Resistant PLA Resin For Thermoforming Packaging And 3D Printing

Product Tags:

Heat Resistant PLA Resin

      

PLA Resin For Thermoforming Packaging

      

PLA Resin For 3D Printing

      
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